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Sonics and Summit Design Team to Accelerate Industrywide SystemC Platform SoC Transformation; Summit to Distribute Sonics SMART Interconnect SystemC Models as Part of Recently Launched IP Initiative
MOUNTAIN VIEW, Calif.—(BUSINESS WIRE)—July 19, 2006—
Sonics Inc.(R), the premier supplier of system-on-chip
(SoC) SMART Interconnect(TM) solutions, and Summit Design, Inc., a
leading provider of electronic system-level (ESL) design solutions,
today announce a broad agreement by which Summit will distribute
SystemC language versions of Sonics' SMART Interconnect solutions that
operate seamlessly within Summit's Panorama(TM) and Vista(TM) design
environments.
The collaboration between Sonics and Summit Design makes available
a comprehensive SystemC modeling environment, based on the Open
SystemC Initiative (OSCI) standard that directly addresses critical
design challenges surrounding system-on-chip (SoC) development today.
The SystemC models of Sonics' SMART Interconnects will be integrated
with advanced system-level architectural exploration capabilities
found in Panorama, to provide the key linkage that enables better
architectural characterization of the SoC device under development,
throughout all the SoC development teams. These models will support
Vista's advanced debugging and verification capabilities to simplify
assembly and verification of SoCs that incorporate Sonics SMART
Interconnects.
"We are pleased to announce the availability of the SMART
Interconnect models through our recently established IP initiative and
to support interoperability of these models with the other models in
our IP portfolio," says Emil Girczyc, president and CEO of Summit
Design, Inc. "Customers using Sonics' SystemC SMART Interconnect
models will have the full support of Vista's advanced debug features
and Panorama's architectural performance and power analysis, which
enables design teams to simplify and accelerate their system-level
design. Through this partnership we will offer our mutual customers
the best ESL design environment available."
For direct sale, Summit Design will offer SystemC-based versions
of the Sonics SMART Interconnect solutions that are compatible with
the Vista and Panorama design environments. Summit will also sell a
limited function version of SonicsStudio(TM), a tool used to configure
the SystemC versions of Sonics SMART Interconnect solutions which
provides customers with 'one-stop shopping' through Summit Design for
their Sonics SystemC needs.
A fully-featured version of SonicsStudio, available from Sonics,
can then convert the same SystemC model configuration data developed
in the Panorama environment into a Verilog HDL version, guaranteeing a
rapid transition from architectural exploration into logical and
physical design for any given chip using the Panorama modeling
approach.
"The partnership announced with Summit continues Sonics'
commitment to provide SMART Interconnect customers with the most
comprehensive SystemC modeling environments available today," says
Grant Pierce, president and CEO, Sonics Inc.
Demonstrations of Sonics SMART Interconnect solutions, in Vista
and Panorama, will be conducted July 24-27 in Summit Design's booth
#1028 at the Design Automation Conference (DAC), July 24-27 at Moscone
Center in San Francisco.
About Sonics
Sonics, Inc. (R) is the premier supplier of SMART Interconnect(TM)
solutions that deliver high SoC design predictability and increased
design efficiency. Major semiconductor and systems companies including
Broadcom, Samsung, Texas Instruments and Toshiba have applied Sonics'
SMART Interconnects solutions in leading products in the wireless,
digital multimedia and communications markets. Sonics is a
privately-held company funded by Cadence Design Systems, Toshiba
Corporation, Samsung Ventures, and venture capital firms Investar
Capital, Smart Technology Ventures, TL Ventures, Easton Hunt Capital,
JAFCO Ventures, and H&Q Asia-Pacific. For more information, see
www.sonicsinc.com.
About Summit
Summit Design's industry-leading ESL and HDL solutions enable SOC
companies to deliver products that meet system-level performance and
power targets with dramatically reduced schedule risk. Summit's
products address engineering challenges met during the specification
and implementation design phases of complex hardware/software systems.
Panorama(TM) allows designers to perform real-time application
emulation of both the hardware and software portions of an embedded
SoC, before core and IP selections are finalized. Vista(TM) is an
integrated development environment (IDE) for SystemC that combines
both hardware and software concepts to speed design and debug of
SystemC and TLM applications. Visual Elite(TM) is a state-of-the-art
design, integration and verification platform which enables designers
to intuitively capture and validate their designs using high-level
design techniques and languages. Top electronics companies worldwide,
including leaders in the wireless, automotive, and consumer
electronics space, have achieved dramatic reductions in design cycle
time through their use of Summit's products. Summit Design is
headquartered in Los Altos, California, with offices throughout the
US, Europe, Japan, Israel, and ROA. To learn more, please visit
http://www.sd.com.
Sonics Inc. and the company's logo are registered trademarks, and
SMART Interconnects and SonicsStudio are trademarks of Sonics, Inc.
Vista and Panorama are trademarks of Summit Design, Inc. All other
trademarks are the property of their respective owners.
Contact:
Fast Forward Public Relations (for Sonics)
Mary Jane Reiter, 408-725-1239
Email Contact
or
Summit Design
Francine Bacchini, 408-839-8153
Email Contact
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